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Tag Archives : New Products

Molex Debuts Nano-Pitch I/O™ 80-Circuit Interconnect at DesignCon 2016 System offers highest port density and speed in the smallest available package

https://www.molex.com/molex/news/display_news.jsp?channel=New&channelId=-8&oid=2037 March 15, 2016 Comments Off on Molex Debuts Nano-Pitch I/O™ 80-Circuit Interconnect at DesignCon 2016 System offers highest port density and speed in the smallest available package

System offers highest port density and speed in the smallest available package LISLE, IL – March 9, 2016 – At DesignCon 2016, Molex, LLC introduced the Nano-Pitch I/O™ 80-Circuit Interconnect... Read More

Cadence Announces Availability of Complete IC Packaging Design and Analysis Solutions for Advanced Fan-Out Wafer-Level Chip Scale Packaging

https://www.cadence.com/cadence/newsroom/press_releases/Pages/pr.aspx?xml=031416_icpkg March 15, 2016 Comments Off on Cadence Announces Availability of Complete IC Packaging Design and Analysis Solutions for Advanced Fan-Out Wafer-Level Chip Scale Packaging

Cross-fabric optimization accelerates multi-chip integration for smaller, lighter, power-optimized wireless mobile devices Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced the availability of the industry’s only foundry-proven IC packaging design... Read More

Microchip Announces Four Low-Power Embedded Wi-Fi® Solutions for Growing IoT Market

https://www.microchip.com/ March 15, 2016 Comments Off on Microchip Announces Four Low-Power Embedded Wi-Fi® Solutions for Growing IoT Market

Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, announced today four compact, low-power, highly integrated solutions that allow Wi-Fi®and networking capability to be embedded into... Read More

Sony Announces a New Type 1/2.6 22.5 Megapixel Exmor RS™, the Industry’s First*1 Stacked CMOS Image Sensor with Built-in Hybrid Autofocus and 3-Axis Electronic Image Stabilization

https://www.sony.net/SonyInfo/News/Press/201602/16-013E/ March 15, 2016 Comments Off on Sony Announces a New Type 1/2.6 22.5 Megapixel Exmor RS™, the Industry’s First*1 Stacked CMOS Image Sensor with Built-in Hybrid Autofocus and 3-Axis Electronic Image Stabilization

Sony Corporation (“Sony”) is announcing the commercialization of a new Exmor RS™ image sensor for smartphones and other devices that require increasingly better cameras and thinner form factors. The IMX318... Read More

Renesas Electronics Delivers New Lineup of Intelligent Power Devices with Low On-Resistance as Replacement for Relays in Automotive Applications to Contribute to Reduced Vehicle Weight

https://am.renesas.com/ March 15, 2016 Comments Off on Renesas Electronics Delivers New Lineup of Intelligent Power Devices with Low On-Resistance as Replacement for Relays in Automotive Applications to Contribute to Reduced Vehicle Weight

Targeted toward Expanded Adoption in High-Current Load Switch Applications Such as Motor and Heater Control Circuits Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced... Read More

Low-Power Electric Motors Can Now Dissipate Even Less Power with New Intelligent Power Modules from STMicroelectronics

https://www.st.com/web/en/news/n3761 March 15, 2016 Comments Off on Low-Power Electric Motors Can Now Dissipate Even Less Power with New Intelligent Power Modules from STMicroelectronics

STMicroelectronics has expanded its Intelligent Power Module portfolio with the introduction of the SLLIMM™[1] -nano 2nd series, adding higher power levels and new package options that are especially suited to... Read More

Samsung Introduces Full Line-up of LED Components Based on Chip-Scale Packaging Technology Based on Chip-Scale Packaging Technology

https://news.samsung.com/ March 15, 2016 Comments Off on Samsung Introduces Full Line-up of LED Components Based on Chip-Scale Packaging Technology Based on Chip-Scale Packaging Technology

Samsung Electronics, a world leader in advanced component solutions, introduced a full line-up of chip-scale LED packages* (CSP), including 0.6W-class and 3W-class packages, CSP arrays, and PoW (Phosphor on Wafer)... Read More

MediaTek Launches Imagiq™ Image Signal Processor

https://www.mediatek.com/ March 15, 2016 Comments Off on MediaTek Launches Imagiq™ Image Signal Processor

MediaTek Launches Imagiq™ Image Signal Processor, Accelerating the Smartphone Multimedia Revolution Dual camera support, high-definition images and video features offer uncompromising mobile photography experience MediaTek today announced the ImagiqTMimage signal... Read More

Xilinx Demonstrates 56G PAM4 Transceiver Technology

press.xilinx.com March 14, 2016 Comments Off on Xilinx Demonstrates 56G PAM4 Transceiver Technology

Xilinx, Inc. announced it has developed a 16nm FinFET+-based programmable device running 56G transceiver technology using the 4-level Pulse Amplitude Modulation (PAM4) transmission scheme. Recognized by the industry as the... Read More