Toshiba launches 1.5A LDO regulators in ultra-small package

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Toshiba Electronics Europe has started shipping a new low-dropout (LDO) regulator series in the industry’s smallest WCSP6F package measuring just 1.2mm x 0.8mm x 0.3mm. The TCR15AG series comprises of... Read More

u-blox announces smallest industrial Bluetooth 5 module

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Ultra-compact and designed for tough environments, ANNA-B1 is fully tailored to applications for the Industrial Internet of Things. Thalwil, Switzerland – March 13, 2018 – u-blox (SIX:UBXN), a global leader... Read More

Cypress Brings Superior Infotainment Experience to Connected Cars

https://www.cypress.com Comments Off on Cypress Brings Superior Infotainment Experience to Connected Cars

Cypress Semiconductor Corp. (NASDAQ: CY), the leader in advanced embedded system solutions, today announced production availability of a combo solution that delivers robust 2×2 MIMO 802.11ac Wi-Fi® and Bluetooth® connectivity to vehicles,... Read More

ON Semiconductor Introduces Preconfigured Development Suite Providing Easier Way to Build Hearing Aids

https://www.onsemi.com Comments Off on ON Semiconductor Introduces Preconfigured Development Suite Providing Easier Way to Build Hearing Aids

New development toolkit includes wireless-enabled firmware with adaptive audio algorithms, development software and cross-platform software development kit (SDK) for industry-leading Ezairo® DSP platform ON Semiconductor (Nasdaq: ON), driving energy efficient innovations,... Read More

ams audio chips offer world-class noise-cancelling performance in two new wireless headphones from trend-setter FIIL

www.ams.com Comments Off on ams audio chips offer world-class noise-cancelling performance in two new wireless headphones from trend-setter FIIL

Low-power, high performance AS3435 and miniature AS3412 noise-cancelling ICs enable FIIL to achieve outstanding ANC performance in its innovative next-gen on- and in-ear headphones ams (SIX: AMS), a leading worldwide... Read More