Explore the latest GaN and SiC technologies to ‘Electrify Our World’ & deliver the most efficient and reliable power solutions for AI data centers, EVs, and consumer markets, from 20... Read More
IBM Introduces Granite 3.0: High Performing AI Models Built for Business
IBM Introduces Granite 3.0: High Performing AI Models Built for Business New Granite 3.0 8B & 2B models, released under the permissive Apache 2.0 license, show strong performance across many... Read More
Tria Technologies Launches New COM Express Type 6 Carrier Board
Enhanced reference platform for rapid prototyping, technology evaluation, system design and application software development the newly announced brand from Avnet for embedded compute boards, is set to make life easier... Read More
DigiKey Brings Popular New Products to Maker Faire Rome 2024
DigiKey, a leading global commerce distributor offering the largest selection of technical components and automation products in stock for immediate shipment, will demonstrate sought-after new products for makers in... Read More
Melexis Launches World’s First 60W Single-Coil Sensorless BLDC Driver
Melexis announces the MLX90416, a 24V/60W sensorless single-coil BLDC driver specifically designed for motor, fan and pump applications across both consumer electronics and industrial domains. At present, many consumer and... Read More
Infineon launches ultra-high current density power modules to enable high-performance AI computing
Data centers are currently responsible for more than two percent of global energy consumption. Fueled by AI, this number is expected to grow to up to around seven percent in... Read More
New STM32MP255-powered SoM from Direct Insight delivers 64-bit performance across full industrial temperature range
Affordable SODIMM module features NPU, GPU, HD video and USB 3.0 Direct Insight, the UK-based technical systems integrator and reseller of system-on-module (SoM) and other embedded systems, has launched a... Read More
Enclustra Redefines RF Performance and Programmability in a Compact, Low-power Package
Enclustra’s Andromeda XRU50 RFSoC module brings cutting-edge capabilities and unparalleled flexibility to emerging FPGA-based radiofrequency applications. Highlights: • The Andromeda XRU50 integrates AMD’s Zynq™ UltraScale+™ RFSoC to support demanding RF... Read More
Melexis introduces digital output Triphibian™ pressure sensor
Melexis expands its Triphibian™ family with the MLX90834 pressure sensor, designed for automotive applications such as EV thermal management. This robust, factory-calibrated MEMS solution accurately measures pressure in both gas... Read More
Pulsiv release the world’s most efficient 65W USB-C design with 30% lower temperatures, integrated half-active bridge, and 96% efficiency
Pulsiv Limited, the Cambridge (UK) innovator of power electronics technology, have announced the release of the world’s most efficient* 65W USB-C GaN optimised reference design developed to address the complex... Read More