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Application-ready congatec COM/carrier combo

May 28, 2020 Comments Off on Application-ready congatec COM/carrier combo

Size-optimized congatec SMARC 2.1 carrier board makes Intel Atom processor based 3.5-inch SBCs modular Deggendorf, Germany, 28 May 2020 * * * congatec – a leading vendor of embedded computer technology... Read More

IAR Systems takes RISC-V to the next level with launch of professional development tools with leading performance and ensured code quality

May 22, 2019 Comments Off on IAR Systems takes RISC-V to the next level with launch of professional development tools with leading performance and ensured code quality

IAR Systems®, the future-proof supplier of software tools and services for embedded development, announces the immediate availability of the leading C/C++ compiler and debugger toolchain IAR Embedded Workbench® with support... Read More

PCIe 3.1 Ethernet bridges using low-power sub-states enable power savings for embedded and automotive platforms

February 12, 2019 Comments Off on PCIe 3.1 Ethernet bridges using low-power sub-states enable power savings for embedded and automotive platforms

Microchip announces the LAN7430/1 Ethernet bridge which provides new options for embedded and automotive platform designers who are seeking Peripheral Component Interconnect Express® (PCIe®) 3.1 Low-Power Sub-State (LPSS) L1.1 and... Read More

Samsung Breaks Terabyte Threshold for Smartphone Storage with Industry’s First 1TB Embedded Universal Flash Storage

news.samsung.com February 1, 2019 Comments Off on Samsung Breaks Terabyte Threshold for Smartphone Storage with Industry’s First 1TB Embedded Universal Flash Storage

Samsung Electronics, the world leader in advanced memory technology, announced that it has begun mass producing the industry’s first one-terabyte (TB) embedded Universal Flash Storage (eUFS) 2.1, for use in... Read More