Infineon introduces the highly-integrated and scalable wireless charging platform WLC with Qi-compliant and configurable controllers

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Munich, Germany, and Taipei, Taiwan – 24 May, 2022 – The wireless charging market has been increasingly growing over the last years, with more and more applications applying this capability... Read More

Nexperia widens its offering of discrete components in miniature DFN packaging with side-wettable flanks

New-Tech Magazines Group Ltd. Comments Off on Nexperia widens its offering of discrete components in miniature DFN packaging with side-wettable flanks

Nexperia, the expert in essential semiconductors, today announced its latest product additions to a growing range of discrete devices which it provides in leadless DFN packages with side-wettable flanks (SWF). These... Read More

Infineon boosts IPOSIM platform with automated lifetime estimation to simplify selection of suitable semiconductor components

https://www.infineon.com/cms/en/about-infineon/press/market-news/2022/INFIPC202203-063.html Comments Off on Infineon boosts IPOSIM platform with automated lifetime estimation to simplify selection of suitable semiconductor components

Infineon Power Simulation platform (IPOSIM) from Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is widely used for calculating losses and thermal behavior of power modules, discretes and disc devices.... Read More

Replace Silicon IGBTs with Industry’s Most Rugged Silicon Carbide Power Devices Now Available at 1700V

New-Tech Magazines Group Ltd. Comments Off on Replace Silicon IGBTs with Industry’s Most Rugged Silicon Carbide Power Devices Now Available at 1700V

Silicon carbide portfolio with 1700V MOSFET die, discrete and power module devices extend designers’ options for efficiency, power density CHANDLER, Ariz., July 27, 2021 – Today’s energy-efficient electric charging systems... Read More