Vicor, the high-performance power module company, will showcase its expertise in 48V on June 26-29 delivering two sessions at the Automotive HV Power Supply Systems Conference in Munich. In the... Read More
Intel’s New Chip to Advance Silicon Spin Qubit Research for Quantum Computing
Today, Intel announced the release of its newest quantum research chip, Tunnel Falls, a 12-qubit silicon chip, and it is making the chip available to the quantum research community. In... Read More
Next generation 1200 V CoolSiC™ Trench MOSFET in TO263-7 package boosts e-Mobility
Infineon presents its new generation of 1200 V CoolSiC™ MOSFETs in TO263-7 for automotive applications. The automotive-graded silicon carbide (SiC) MOSFET generation offers high power density and efficiency, enables bi-directional... Read More
New Cesium Atomic Clock Provides Autonomous Precise Time of 100 ns Holdover for Months
Microchip’s 5071B is a compact commercial timing product offering ease of deployment across multiple industries CHANDLER, Ariz., June 12, 2023 — From everyday applications such as mobile phones and banking... Read More
u-blox announces two new high-precision GNSS positioning modules based on the successful F9 platform
The NEO-F9P enables precise navigation and automation of moving industrial machinery, while the ZED-F9P-15B offers customers in the mobile robotics market an L1/L5 alternative to L1/L2. u-blox (SIX:UBXN), a global... Read More
Infineon’s HYPERRAM™ 3.0 memory and Autotalks’ 3rd generation chipset drive next-generation automotive V2X applications
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Autotalks announced today that the two companies are collaborating to deliver solutions for next-generation V2X (Vehicle-to-Everything communication) applications. In this collaboration,... Read More
Renesas Expands Market-Leading Motor Control Embedded Processing Portfolio with Over 35 New MCUs
Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today debuted three new MCU groups targeting motor control applications. Renesas is introducing over 35 new products, including devices... Read More
Infineon launches SLC26P security controller based on 28 nm technology for payment applications; expands its supply option to enable long-term, dependable sourcing for smart card and embedded security ICs
Commercial production of integrated circuits using 28 nm technology node began several years ago. As the process technology has matured, market demand for 28 nm products has also increased. Although... Read More
Achieve maximum design flexibility with Molex Mirror Mezz Connectors
Footprint-compatible Hermaphroditic Mirror Mezz connector lowers application costs with stackable mating to support data speeds up to 56 Gbps per differential pair for telecommunications, networking, and other applications. Contact details:... Read More
Infineon launches XENSIV™ connected sensor kit, a new IoT sensors platform
IoT ecosystems and connected devices enable new service offerings and peripheral services to be bought and unlocked. However, prototyping sensor-based IoT use cases can become a resource intensive process until... Read More