Components

Vicor to present how to accelerate xEV design using 48V at Automotive HV Power Supply Systems Conference in MunichVicor to present how to accelerate xEV design using 48V at Automotive HV Power Supply Systems Conference in Munich

Vicor to present how to accelerate xEV design using 48V at Automotive HV Power Supply Systems Conference in Munich

Vicor, the high-performance power module company, will showcase its expertise in 48V on June 26-29 delivering two sessions at the…

2 years ago
Intel’s New Chip to Advance Silicon Spin Qubit Research for Quantum ComputingIntel’s New Chip to Advance Silicon Spin Qubit Research for Quantum Computing

Intel’s New Chip to Advance Silicon Spin Qubit Research for Quantum Computing

Today, Intel announced the release of its newest quantum research chip, Tunnel Falls, a 12-qubit silicon chip, and it is…

2 years ago
Next generation 1200 V CoolSiC™ Trench MOSFET in TO263-7 package boosts e-MobilityNext generation 1200 V CoolSiC™ Trench MOSFET in TO263-7 package boosts e-Mobility

Next generation 1200 V CoolSiC™ Trench MOSFET in TO263-7 package boosts e-Mobility

Infineon presents its new generation of 1200 V CoolSiC™ MOSFETs in TO263-7 for automotive applications. The automotive-graded silicon carbide (SiC)…

2 years ago
New Cesium Atomic Clock Provides Autonomous Precise Time of  100 ns Holdover for MonthsNew Cesium Atomic Clock Provides Autonomous Precise Time of  100 ns Holdover for Months

New Cesium Atomic Clock Provides Autonomous Precise Time of 100 ns Holdover for Months

Microchip’s 5071B is a compact commercial timing product offering ease of deployment across multiple industries CHANDLER, Ariz., June 12, 2023…

2 years ago
u-blox announces two new high-precision GNSS positioning modules based on the successful F9 platformu-blox announces two new high-precision GNSS positioning modules based on the successful F9 platform

u-blox announces two new high-precision GNSS positioning modules based on the successful F9 platform

The NEO-F9P enables precise navigation and automation of moving industrial machinery, while the ZED-F9P-15B offers customers in the mobile robotics…

2 years ago
Infineon’s HYPERRAM™ 3.0 memory and Autotalks’ 3rd generation chipset drive next-generation automotive V2X applicationsInfineon’s HYPERRAM™ 3.0 memory and Autotalks’ 3rd generation chipset drive next-generation automotive V2X applications

Infineon’s HYPERRAM™ 3.0 memory and Autotalks’ 3rd generation chipset drive next-generation automotive V2X applications

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Autotalks announced today that the two companies are collaborating to deliver…

2 years ago
Renesas Expands Market-Leading Motor Control Embedded Processing Portfolio with Over 35 New MCUsRenesas Expands Market-Leading Motor Control Embedded Processing Portfolio with Over 35 New MCUs

Renesas Expands Market-Leading Motor Control Embedded Processing Portfolio with Over 35 New MCUs

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today debuted three new MCU groups targeting motor control…

2 years ago
Achieve maximum design flexibility with Molex Mirror Mezz ConnectorsAchieve maximum design flexibility with Molex Mirror Mezz Connectors

Achieve maximum design flexibility with Molex Mirror Mezz Connectors

Footprint-compatible Hermaphroditic Mirror Mezz connector lowers application costs with stackable mating to support data speeds up to 56 Gbps per…

2 years ago
Infineon launches XENSIV™ connected sensor kit, a new IoT sensors platformInfineon launches XENSIV™ connected sensor kit, a new IoT sensors platform

Infineon launches XENSIV™ connected sensor kit, a new IoT sensors platform

IoT ecosystems and connected devices enable new service offerings and peripheral services to be bought and unlocked. However, prototyping sensor-based…

2 years ago