At CES® 2017, NXP Semiconductors (NASDAQ:NXPI), the world’s leading provider of automotive electronics solutions, announced a long-term strategic partnership with Geely Automobile Group, a Chinese multinational automotive manufacturing company. The... Read More
Dassault Systèmes Boosts Experience-Thinking Innovation on the 3DEXPERIENCE Platform with the HTC Vive Business Edition
VELIZY-VILLACOUBLAY, France and LAS VEGAS — January 5, 2017 — Dassault Systèmes (Euronext Paris: #13065, DSY.PA), the 3DEXPERIENCE Company, world leader in 3D design software, 3D Digital Mock Up and... Read More
ASUS relies on Infineon REAL3™ image sensor chip to bring Augmented Reality into compact smartphones
Munich, Germany, and Las Vegas, NV, USA – January 5, 2017 – The REAL3™image sensor chip from Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) plays a key role in... Read More
Qualcomm Brings Active Noise Cancelling Technology into Ultra-Small Earbuds and Headphones
Qualcomm Incorporated (NASDAQ: QCOM) today announced that its subsidiary, Qualcomm Technologies, International, Ltd., has introduced active noise cancelling (ANC) technology onto its CSR8675 product platform, making it the world’s first... Read More
Faraday Future
Faraday Future (FF) has revealed FF 91 (“nine one”), its first production vehicle, at an exclusive event prior to the 2017 Consumer Electronics Show (CES). Built upon the company’s Variable... Read More
Qualcomm and ODG Announce the First Augmented Reality Smartglasses Powered by the New Snapdragon 835 Processor
At CES® 2017 today, Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated (NASDAQ: QCOM), and ODG (Osterhout Design Group), a leading developer and manufacturer of mobile headworn computing and augmented... Read More
NXP Presents the World’s First One-Chip Solution for All Global In-Car Infotainment and Broadcast Standards
Software-defined, multi-standard device for global digital and analog broadcast standards AM/FM, DAB(+), DRM(+) and HD Ultra-compact single chip integrating six ICs into one: radio and audio as one combined high-performance... Read More
Rohde & Schwarz presents new HLG test solution for latest-generation video consumer electronics
Rohde & Schwarz is expanding its R&S VTx video tester family to include tests for HLG-capable devices in line with the HDMI 2.0b standard. Hybrid Log-Gamma (HLG) is an enhancement... Read More
7th Gen Intel Core
7th Generation Intel Core is the newest family of processors for 2 in 1s and laptops. 7th Gen Intel Core extends the benefits of Intel’s industry leading 14nm process technology,... Read More
Microsoft, NXP Semiconductors, IAV and Auto Mobility Partners Showcase Innovations for Safe, Secure and Personalized Automated Driving at CES 2017
At CES 2017 from Jan. 4‒8 in Las Vegas, Microsoft Corp., NXP Semiconductors, IAV, and auto mobility partners Cubic Telecom, Esri and Swiss Re will showcase their collective vision of... Read More
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