LISLE, IL – May 23, 2023 – Molex, a global electronics leader and connectivity innovator, has introduced the industry’s first chip-to-chip 224G product portfolio, encompassing next-gen cables, backplanes, board-to-board connectors and near-ASIC connector-to-cable solutions operating at speeds up to 224 Gbps-PAM4. As a result, Molex is uniquely positioned to meet heightened demands for the fastest available data rates powering advanced technology including generative AI, machine learning (ML), 1.6T networking and other high-speed applications.
“Molex is collaborating closely with major technology innovators, as well as key data center and enterprise customers, to set an aggressive pace for 224G product introductions,” said Jairo Guerrero, VP & GM, Copper Solutions, at Molex. “Our transparent, co-development approach facilitates early engagement with stakeholders across the 224G ecosystem to identify and resolve potential performance bottlenecks and design challenges, ranging from signal integrity and EMI reduction to the need for more efficient thermal management.”
Connectivity Innovations Empower the 224G Ecosystem
Entirely new system architectures with multiple chip-to-chip connection schemes will be required to achieve data rates up to 224 Gbps-PAM4, which represents an important yet complex technology inflection point. To that end, a cross-functional, global team of Molex engineers collaborated closely with customers, technology leaders and suppliers, using the latest predictive analytics and advanced software simulations, to speed the design and development of a full portfolio of best-in-class solutions, including:
Mirror Mezz Enhanced extends the capabilities of Mirror Mezz and Mirror Mezz Pro, which were selected as the Open Control Module (OCM) standard by the Open Accelerator Infrastructure Group, a subgroup of the Open Compute Project (OCP). This designation reinforces Molex’s overarching commitment to work with industry leaders in supporting the explosive growth of AI and other accelerator infrastructure systems.
Product Availability
Samples of Mirror Mezz Enhanced, Inception and CX2 Dual Speed will be available this summer, with product samples of Molex’s new OSFP and QSFP offerings slated for release in the fall.
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