Categories: LATEST NEWS

The Israeli Redler Technologies has signed a memorandum of understanding (MOU) with Steel Strip Wheels Limited (“SSWL”)

Redler Technologies (“Redler”) Ltd.-an Israel based global engineering company  and Steel Strip Wheels Limited (“SSWL”) India- a global leader in the Automotive Wheel Maker industry announce today the signing of the Memorandum of Understanding (MOU) to establish a joint venture.

focused on the development, manufacturing, and marketing of innovative, state-of-the-art motion control solutions for Two, Three & four-wheeled electric vehicles in India.

Joining India’s fight against pollution for the benefit of future generations around the world.

Radler Technologies, specializing in solutions with international patents in the areas of electrical power and motion technologies for the micro-electric car market through breakthrough technology, has signed the Memorandum of understanding [MOU] with the SSWL – an Indian vehicle giant traded on the Indian exchange market (NSE) and specializes in manufacturing and distributing parts for the automotive industry for motorcycles, and rickshaws.

This Association will synergize SSWL’s Manufacturing capability, large Customer Access, and strong presence in India with Redler’s access to advanced technology.

This will help to bring state-of-the-art technology products with an Aim to Promote ‘MAKE IN INDIA-MAKE FOR WORLD’ with the establishment of a joint JV company, which will produce, market, sell and support technology, in the Indian market the Radler products, smart drivers controllers, and other electronic systems for the small electric vehicle, motorcycles, and electrical rickshaws.

The tiny car market in India produces about 20 million new motorcycles and rickshaws a year, this market, rapidly moves to electrical propulsion, at an increase of about 16% (CAGR) per year, with massive support from the Indian government, encouraging smart technology-based products to be developed in India for this transport, such as those of Radler Technologies, Combine innovative technologies and patents.

The auction was signed between Radler Technologies CEO, Guy Nathanson and the CEO, Mr. Dheeraj Garg of SSWL,
And with the support of SHEPHA, SOOMON & co ADVOCATES, Eshkol and the Israeli Embassy in Delhi.

Radler Technologies CEO, Guy Nathanson:

“The power for significant change can begin when two parts decide to join forces. This technological bridge and collaboration between the two companies is a significant step towards the “Green Revolution” in India’s fight against pollution for the benefit of future generations around the world”


Danit

Recent Posts

Microchip Introduces PIC16F17576 MCU Family to Simplify Analog Sensor Design

Integrated low-power analog peripherals reduce design costs and complexity Devices designed for capturing rapidly changing…

2 days ago

Healthee raises $50M to redefine the future of health benefits

Healthee, the AI-powered platform transforming the health benefits experience, today announced a $50 million Series B funding…

2 days ago

Miggo Raises $17M to Replace Patch-and-Pray with Real-Time Application Resilience

Round led by cybersecurity visionaries SYN Ventures and YL Ventures to accelerate Miggo’s mission to…

2 days ago

New Cymulate Research Shows Security Experts View Threat Exposure Validation as “Absolutely Essential”

The 2025 Cymulate Threat Exposure Validation Impact Report reveals that exposure validation significantly decreases breaches…

2 days ago

DigiKey Adds Nearly 100,000 NPIs and More Than 100 New Suppliers in First Quarter of 2025

DigiKey, a leading global commerce distributor offering the largest selection of technical components and automation…

2 days ago

Pillar Security Raises $9M to Help Enterprises Build and Run Secure AI Software

The round was led by the fund of Dan Caine, Chairman of the Joint Chiefs…

5 days ago