LATEST NEWS

Mouser Electronics Explores the Power Behind AI at the Edge in Next 2021 Empowering Innovation Together Installment

Global Distributor Examines the Ever-Changing Frontier of AI 

July 16, 2021Mouser Electronics Inc. today releases the third installment of the 2021 series of its award-winning Empowering Innovation Together™ program. The series’ third installment dives deep into artificial intelligence (AI), through an engaging collection of video, long-form articles, blog and infographic content.

Embedded electronics systems have continued to evolve alongside the development of machine-learning algorithms. Their union is giving rise to the concept of edge computing. As IoT developers tackle emerging IoT requirements, edge devices will play a central role in addressing the many challenges that lie ahead in large-scale IoT systems, including the necessary security requirements to protect private information.

“As AI impacts more and more aspects of our lives, people want to understand the many facets and potential of this new machine intelligence,” states Glenn Smith, President and CEO of Mouser Electronics. “The series will explore the true definition of AI and what the future may hold in terms of applications, issues, benefits and risks. We hope the series will inform and enlighten.”

The 2021 EIT series will also include four byte-sized videos, Then, Now and Next, in addition to articles, blogs, infographics and other content with discussions led by Mouser thought leaders and other experts. Future tech topics following artificial intelligence will delve deeper into connected cars and industrial automation and review new product technologies like sensors and RF and wireless. The program spotlights various new product developments and unveils the technical developments required to stay up to date with new trends in the marketplace.

The third episode of the series is sponsored by Mouser’s valued manufacturer partners Advantech, Intel®, Maxim Integrated, Microchip Technology, Micron, NXP Semiconductors, TE Connectivity and Xilinx.

Liat

Recent Posts

Hailo to Showcase AI Processing Capability for the New Era of Generative AI on the Edge at CES 2025

Product demonstrations will include Hailo-powered cameras and embedded devices in various industries and use cases…

4 days ago

Integrated and Compact CAN FD System Basis Chip Solution for Space-Constrained Applications

 The increase in connected applications in the automotive and industrial markets is driving demand for…

5 days ago

Available from Powell Electronics are compact and cost-competitive MIP series pressure transducers for heavy-duty applications from Honeywell

Available from stock though Powell Electronics, the supplier of connectors and more for high-rel applications…

5 days ago

DigiKey Announces Global Distribution Partnership with MediaTek

 DigiKey, a leading global commerce distributor offering the largest selection of technical components and automation…

1 week ago

Astrix Security Raises $45M Series B to Redefine Identity Security for the AI Era

Astrix Security, the enterprise's trusted solution for securing non-human identities (NHIs), announced $45 million in…

2 weeks ago

ROHM and TSMC Launch Strategic Gallium Nitride Technology Collaboration for Automotive Industry

ROHM Co., Ltd. (ROHM) announced today that ROHM and TSMC have entered a strategic partnership…

2 weeks ago