LATEST NEWS

AEC-Q100 Qualified and Defense-grade PolarFire® FPGAs Now Available in Volume Production

Expanded product offering with robust device certification and characterization gives customers programmable logic solutions ideal for thermally challenging environments

CHANDLER, Ariz., March , 2021 – Automotive, defense, aerospace and industrial designers who need automotive- and defense-grade programmable logic solutions can now order PolarFire Field Programmable Gate Arrays (FPGAs) in volume production quantities. Microchip Technology (Nasdaq: MCHP) today announced it is shipping PolarFire FPGAs qualified for both the Automotive Electronics Council Q100 (AEC-Q100) specification Grade T2 (-40°C to 125°C TJ) and military temperature grade (-40°C to 125°C TJ).

These offerings extend Microchip’s low-power leadership as a supplier of FPGAs for diverse high-reliability markets. With their thermal and space design constraints, automotive, industrial and military applications deployed in harsh environments require solutions that offer power and space efficiency as well as cryptographic security. PolarFire FPGAs offer on-chip security features that enable secure communication, an encrypted bitstream, and a cryptographically secured supply chain, ensuring tamper-proof solutions for these market segments.

Unlike SRAM-based FPGAs, Microchip devices can operate without fans and in some cases without heatsinks, simplifying the thermal design of the system and creating new opportunities for smaller, lighter designs. This is especially important in automotive applications such as blind spot detection, lane change warning systems and back up cameras. Additionally, the extended temperature range of our military grade devices coupled with our state-of-the-art security enables developers to trust and add more compute power within a thermally constrained environments such as those found in advanced strategic weapons systems.

“Removing heat from a system is not free,” said Bruce Weyer, vice president of Microchip’s FPGA business unit. “The less heat you move, the lower your total system costs become. In some cases, complete removal of fans from systems, which often have a low mean time between failure, is possible. Automotive and aerospace design engineers can now develop mid-range FPGA solutions with the lowest total power, highest reliability, and best-in-class security technologies, all at a lower total system cost.”


SIVAN

Recent Posts

IBM and L’Oréal to Build First AI Model to Advance the Creation of Sustainable Cosmetics

IBM (NYSE: IBM) and L'Oréal, the world's leading beauty company, announced a collaboration to leverage IBM's generative…

6 hours ago

RIKEN adopts Siemens’ emulation and High-Level Synthesis platforms for next-generation AI device research

Siemens’ emulation and HLS platforms support leading Japanese research institute’s evaluation of optimized AI computing…

1 day ago

Nilus Raises $10M, Reaching $18M in Funding to Lead the Future of AI-Powered Treasury Management

Nilus, the first proactive AI-powered treasury management platform, has raised an additional $10M in a…

1 day ago

Reeco Raises $15M Series A Round to Modernize Hotel Procurement with AI-Driven Procure-to-Pay Platform

Funding will drive Reeco’s strategic growth initiatives as it streamlines back-of-house operations for North American…

4 days ago

Introducing RUBY-W2: u-blox’s first Wi-Fi 7 module for superior Apple® CarPlay and Android® Auto user experience

Connect more concurrent users with the advanced Wi-Fi 7 capabilities of the Snapdragon® Auto Connectivity…

4 days ago

Anritsu Extend Spectrum Measurement Frequency to Millimeter-wave Band with External Mixer from VDI or Eravant

- Supporting Millimeter-wave Band of Medical and Automotive Device Evaluations - Anritsu Corporation is pleased…

4 days ago