Toshiba Memory Europe GmbH today announced a range of four new JEDEC e-MMC (Embedded MultiMediaCard) Ver. 5.1 compliant embedded flash memory products for consumer applications. The new products integrate Toshiba Memory’s 15nm BiCS FLASH™ 3D flash memory and a controller in a single package. All of the new products support the command queuing and secure write protection functions, specified as an option in the standard.
Available in capacities ranging from 16 gigabyte (GB) to 128GB[1], Toshiba’s new e-MMC devices support sequential read and write speeds that are up to 52% faster than the corresponding speeds of Toshiba’s previous e-MMC devices[2].
e-MMC combines highly efficient NAND flash memory with an integrated controller and enhanced memory management. It offers an optimal solution for applications where higher data volumes need to be stored in a cost-efficient way. e-MMC remains an important solution for many modern applications and Toshiba Memory’s new products will enable all applications to have access to the latest flash technology.
Housed in a small 153-ball FBGA package measuring just 11.5mm x 13.0mm x 0.8mm, the new products are able to work across the temperature range -25°C to +85°C. They offer bus widths of x1 / x4 / x8 and require 3.3V for the memory core and 1.8V for the interface logic.
The company will continue to reinforce its market-leading position by delivering a broad, high-performance product lineup, including for applications that continue to need e-MMC as an embedded memory solution.
The new devices will begin sampling in March 2019 with mass production starting during Q3, 2019.
