MUNICH – NanoLock Security and Winbond will debut the first ever solution to securely protect and manage IoT devices from the device’s persistent memory all the way to the cloud at electronica 2018¸ November 13-16¸ Messe Munich. The joint solution¸ available for demonstrations in Hall B5 Booth 520¸ provides embedded lightweight¸ ironclad security and manages flash memory¸ controlled from the cloud.
“As IoT devices become more connected¸ the cyber threat to those devices also increases. The secure data storage is indispensable in protecting data integrity and confidentiality to prevent cyber threats¸” said Hung-Wei Chen¸ Marketing Director¸ Winbond. “With nearly zero impact on our bill of materials¸ adding NanoLock’s IoT security solution and management platform to our secure flash memory chips allows us to provide the essential level of protection for our customers implementing these complex and secure IoT devices.”
The NanoLock and Winbond end-to-end solution ensures IoT devices¸ such as automotive ECUs/MCUs¸ cameras¸ ICS solutions and routers¸ are protected as well as managed from the cloud. The OS/CPU agnostic solution guarantees flash-to-cloud integrity and mutual protection during regular operations and firmware-over-the-air (FOTA) updates¸ from the production line and through and after the device’s end of life¸ all regardless of available processor power¸ energy consumption and even if the end device is inevitably hacked.
“Securing the flash memory is the most fundamental aspect of device-to-cloud protection. Our collaboration with Winbond signifies the seriousness of the IoT industry’s intent to tackle life-critical vulnerabilities stemming from unprotected IoT systems¸” said Eran Fine¸ CEO¸ NanoLock. “Our joint solution ensures the network of IoT devices are fully protected and managed during operation and during the update process from the embedded layer to the cloud controlling these devices.”
The NanoLock and Winbond solution is already being tested with multiple joint customers piloting the IoT security and management platform.
Lenovo has redefined laptop innovation with the introduction of the Yoga Slim 9i, the world’s…
TDK Corporation (TSE 6762) announces the introduction of multiple option configurations for the TDK-Lambda brand…
Introducing MECC: A seamless, scalable solution to unlock global IoT connectivity using nRF9151 module Nordic…
TOLL package 650V GaN HEMTs contribute to improving power supply efficiency Willich-Münchheide, Germany, March 05,…
Development tool offers powerful debugging at a more affordable price for professional engineers, students and…
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced the addition of P-channel power MOSFETs…