Categories: LATEST NEWS

Arrow Electronics IC Solution Reduces IO-Link Development Time and Costs

Arrow Electronics has announced a new family of IC devices that enable companies to quickly add IO-Link Master functionality to their products without the addition of royalties or licence fees. Arrow joined the IO-Link Consortium in April.

The first device launched is a fully integrated STM32 microcontroller with an IO-Link Master software stack, IOLM4P-STM32L, which can control up to four IO-Link Devices via various IO-Link transceivers. The all-in-one IO-Link Master 4-port solution, will help to simplify designs, accelerate development schedules, reduce software development efforts and cut down on non-recurring engineering costs.

Arrow created the IOLM4P with TEConcept, a German engineering company that is an accredited IO-Link competence and test centre. TEConcept develops IO-Link protocol stacks for masters and devices as well as tools for conformance tests.

Industry 4.0 and smart factory requirements have resulted in integration of IO-Link (IEC 61131-9) connectivity becoming increasingly important when developing products for the industrial market. Manufacturers designing an IO-Link multiport Master typically implement the interface protocol on a dedicated microcontroller. The protocol stack is usually licensed from a third-party technology provider as the development of a new stack can be expensive and time consuming. Nevertheless, this approach still introduces considerable NRE costs and requires porting the stack to a microcontroller and an IO-Link transceiver.

To help developers reduce time to market, Arrow worked with TEConcept to produce a new family of devices based on STM32L-Series  microcontrollers and IO-Link ICs like the L6360 and L6362 from STMicroelectronics. The first offering, IOLM4P-STM32L, includes the proven TEConcept IO-Link Master stack and supports the connection of up to four independent IO-Link Devices at cycle times down to 400 µs. It is controlled via a simple SPI-based command interface by host systems that typically connect to field busses or proprietary backplane busses.

Lihi

Recent Posts

Lenovo Just Launched the World’s First Laptop with an Under-Display Camera: Here’s How They Did It

Lenovo has redefined laptop innovation with the introduction of the Yoga Slim 9i, the world’s…

4 days ago

Power Supplies 10 to 50W industrial power supply series expanded with new mounting and protection options for increased system flexibility

TDK Corporation (TSE 6762) announces the introduction of multiple option configurations for the TDK-Lambda brand…

4 days ago

Nordic Semiconductor collaborates with Deutsche Telekom to make everything cellular connected

Introducing MECC: A seamless, scalable solution to unlock global IoT connectivity using nRF9151 module Nordic…

4 days ago

ROHM’s EcoGaN™ has been Adopted for AI Server Power Supplies by Murata Power Solutions

TOLL package 650V GaN HEMTs contribute to improving power supply efficiency Willich-Münchheide, Germany, March 05,…

4 days ago

Microchip Technology Releases Versatile MPLAB® PICkit™ Basic Debugger

Development tool offers powerful debugging at a more affordable price for professional engineers, students and…

4 days ago

Infineon extends radiation-tolerant power MOSFET portfolio for space applications with first P-channel device

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced the addition of P-channel power MOSFETs…

4 days ago