Categories: NEW PRODUCTS

Toshiba launch high current photorelays in DIP4 package

Toshiba Electronics Europe (“Toshiba”) has launched two new high current photorelays that are fabricated using the latest U-MOS IX semiconductor process.

The new TLP3553A and TLP3555A devices feature OFF-state output terminal voltage ratings of 30V and 60V, and ON-state continuous current ratings of 4A and 3A – higher than previous generation products. When operated in pulsed mode, the current ratings increase to 9A for both devices.

Common applications for these devices include industrial equipment (PLCs, I/O interface, sensor controls), building automation systems (heating, ventilation and air conditioning [HVAC]), security equipment and the replacement of mechanical relays in legacy systems.

The TLP3553A features a low ON-state resistance of just 50mΩ (max.) which is less than a typical mechanical relay (about 100mΩ). This ensures that operating losses are kept to a minimum when the device is used to replace mechanical relays such as 1-Form-A that are commonly used in industrial applications. The photorelays are rated for operation at temperatures between -40°C and +110°C, making it easy to achieve a thermal margin in designs.

When mechanical relays are replaced with photorelays, such as the TLP355xA devices, then system reliability is immediately improved. As the photorelays are physically smaller than a mechanical relay, and no additional driver is required, then space and weight is also saved. Both TLP3553A and TLP3555A are provided in a DIP4 package both with and without surface mount option.

Lihi

Recent Posts

QuamCore Emerges from Stealth with $9 Million in Seed Funding to Build World’s First Scalable 1 million Qubit Quantum Computer

Breakthrough in superconducting digital logic removes quantum scaling barriers, paving the way for large-scale quantum…

2 days ago

Qualcomm to Bolster AI and IoT Capabilities with Edge Impulse Acquisition

Highlights:  Acquisition complements strategic approach to IoT transformation, enhances developer enablement and expands leadership in…

5 days ago

Tower Semiconductor and Innolight Expand their Collaboration and Ramp Volume of Next-Generation SiPho Solutions for AI and Data Centers

New Technology Halves Laser Requirements for Streamlined, High-Volume Optical Module Production to Meet Growing AI…

5 days ago

Lenovo Just Launched the World’s First Laptop with an Under-Display Camera: Here’s How They Did It

Lenovo has redefined laptop innovation with the introduction of the Yoga Slim 9i, the world’s…

1 week ago

Power Supplies 10 to 50W industrial power supply series expanded with new mounting and protection options for increased system flexibility

TDK Corporation (TSE 6762) announces the introduction of multiple option configurations for the TDK-Lambda brand…

1 week ago

Nordic Semiconductor collaborates with Deutsche Telekom to make everything cellular connected

Introducing MECC: A seamless, scalable solution to unlock global IoT connectivity using nRF9151 module Nordic…

1 week ago