NEW at FRAMOS: The Cutting-Edge ON Semiconductor AR0430 CMOS Sensor for Simultaneous 2D and 3D Imaging

ON Semiconductor, a global leader in image sensor technology, has recently announced its new AR0430 CMOS digital image sensor. This device, available from the global imaging expert FRAMOS, combines classic 2D video imaging and 3D image recognition on a single sensor. The AR0430 CMOS sensor, with a small 1/3.1-inch optical format, delivers high-quality images with advanced 2.0 µm pixel stacked BSI technology; and, a 4 Megapixel resolution at 120 frames per second (fps). The innovative depth mode enables depth mapping concurrently, while shooting video at 30 fps. ON Semiconductor’s low-cost depth solution empowers both innovative industrial and consumer end-product applications with cutting edge 3D features like cameras for IoT, wearables, security, and AR/VR/MR.

The AR0430 has an active-pixel array of 2312 (H) x 1746 (V), achieving a 4:3 aspect ratio. The device provides low-power performance, drawing a mere 125 mW, when a 4 MP data stream is operating at 30 fps. The low power monitoring mode drawing only 8 mW in standby, is especially valuable in battery-powered security applications. The AR0430 in standard imaging mode, can provide high quality images in both day and night lighting conditions, thereby enhancing its suitability for use in security cameras. This imager, with a large linear full well capacity and high dynamic range, succeeds in challenging light conditions with leading color performance. It can record video at 120 fps in slow motion mode and use the zoom feature, while retaining the resolution quality that is perfect for wearable devices. The feature of depth data at 30 fps promotes the possibility of object recognition, virtual replacement, or downstream AI, that can interpret data for autonomous decisions, or touchless device control.

Sibel Yorulmaz-Cokugur, Sensor Expert and ON Semiconductor Line Manager at FRAMOS, considers the innovative application opportunities provided by the AR0430 imager:

“In today’s world, imaging helps making machines to see, think, and act, predictably. The new AR0430 from ON Semiconductor provides a cutting-edge solution for vision engineers to benefit from the latest 2D and 3D imaging technology using a single device. For example, the user can participate in a video conference while replacing the background for security purposes. Also, it is possible to scan objects and to create simple 3D models for use in virtual reality worlds, or even interpret hand gestures to control smart devices. The standard compact sensor size, for Embedded Vision solutions, fits into many IoT applications and supports miniaturization, too. It also allows multiple camera synchronization for 360-degree cameras, or longer-range depth solutions. The fabrication of devices using depth technology as a baseline for innovative 3D applications, and machines driven by artificial intelligence, is now far easier with the AR0430.”

Simultaneous video and depth mapping is enabled by ON Semiconductor’s Super Depth technology, built on the latest stacked die technology. Super Depth Technology, together with the Color Filter Array (CFA) feature and on-pixel micro-lenses, creates a data stream containing both image and depth data. This data is combined off the sensor, via an algorithm, to deliver a 30-fps video stream and depth map of any object within one meter of the camera. Imaging engineers and system designers will benefit from the AR0430’s significant configuration flexibility. This flexibility includes the ability to program gain, horizontal and vertical blanking, frame size/rate, exposure, image reversal, window size, and panning. Current engineering samples are available in bare die format, and full production will start later in Q1′ 2018.

The industry and product experts at FRAMOS apply their extensive knowledge of sensors, latest 3D technology, and vision based artificial intelligence to support customers integrating the new sensor into their applications and projects. This customer service is complemented with development support, customization, and logistics.