Categories: LATEST NEWS

Xilinx and IBM First to Double Interconnect Performance for Accelerated Cloud Computing with New PCI Express Standard

Xilinx, Inc. (XLNX) announced an achievement in PCI Express® Gen4 capability. Together with IBM, the two companies are first to double interconnect performance between an accelerator and CPU through the use of PCI Express Gen4 compared to the existing widely-deployed PCI Express Gen3 standard. Gen4 doubles the bandwidth between CPUs and accelerators to 16 Gbps per lane, thereby accelerating performance in demanding data center applications such as artificial intelligence and data analytics.

Since the introduction of PCI Express in 2003, Xilinx has been a leader in PCI™ interconnect-based solutions, offering PCI Express compliance across its All Programmable FPGA families. Today IBM and Xilinx have achieved Gen4 interoperability between Xilinx® 16nm UltraScale+™ devices and IBM POWER9 processors, demonstrating the first-ever PCIe Gen4 capability in a programmable device.

“It’s clear the future of data center computing is going to be built on open standards,” said Bradley McCredie, vice president and Fellow at IBM. “This leadership in PCI Express is another reason that POWER architecture is being deployed in modern data centers.”

“We believe in open standards,” said Ivo Bolsens, CTO at Xilinx. “It’s gratifying to see this milestone between our companies that will alleviate significant performance bottlenecks in accelerated computing, particularly for data center computing.”

Liat

Recent Posts

Lenovo Just Launched the World’s First Laptop with an Under-Display Camera: Here’s How They Did It

Lenovo has redefined laptop innovation with the introduction of the Yoga Slim 9i, the world’s…

3 days ago

Power Supplies 10 to 50W industrial power supply series expanded with new mounting and protection options for increased system flexibility

TDK Corporation (TSE 6762) announces the introduction of multiple option configurations for the TDK-Lambda brand…

3 days ago

Nordic Semiconductor collaborates with Deutsche Telekom to make everything cellular connected

Introducing MECC: A seamless, scalable solution to unlock global IoT connectivity using nRF9151 module Nordic…

3 days ago

ROHM’s EcoGaN™ has been Adopted for AI Server Power Supplies by Murata Power Solutions

TOLL package 650V GaN HEMTs contribute to improving power supply efficiency Willich-Münchheide, Germany, March 05,…

4 days ago

Microchip Technology Releases Versatile MPLAB® PICkit™ Basic Debugger

Development tool offers powerful debugging at a more affordable price for professional engineers, students and…

4 days ago

Infineon extends radiation-tolerant power MOSFET portfolio for space applications with first P-channel device

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced the addition of P-channel power MOSFETs…

4 days ago