Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced its aerospace power core module (PCM) with an integrated field programmable gate array (FPGA) and hybrid power drive (HPD) stage. The PCM controls the electrical motors used in applications such as primary flight control actuation, landing gear systems and other systems. The device interfaces seamlessly with both aircraft power supplies and flight controllers, providing vital sensor feedback for health monitoring.
The move toward more electric aircraft (MEA) continues to drive demand for increased levels of reliability and integration in the area of power electronics. Microsemi’s new intelligent power solutions™ play an important role in supporting this objective.
“We are building upon our design-in success on current day MEA platforms with innovative power module construction to develop a portfolio of intelligent power conversion systems. With our growing investment in system-level engineering support and design services, we serve as an extension of our customers’ design teams as we develop solutions for aerospace applications that are optimized for power density, performance, cost and reliability,” said Siobhan Dolan Clancy, vice president and general manager of Microsemi’s Discrete Products Group. “Our aerospace PCM leverages our extensive expertise in IGBTs, SiC MOSFETs, diodes, FPGAs and power modules, bringing together the most advanced capabilities from our worldwide development team and Aviation Center of Excellence.”
According to global market research and consulting company MarketsandMarkets, the actuator, electrical and electronics systems market was valued at $8 billion in 2013 and is expected to grow at a compound annual growth rate (CAGR) of 14 percent to reach $21 billion by 2020. The electrical systems are expected to grow at a CAGR of 16 percent while the electronics components market is estimated to grow at a CAGR of 13 percent. Microsemi’s product development is aligned with these growth trends as the company continues to innovate intelligent power solutions for a variety of these applications.
Microsemi’s new PCM is a highly integrated, flexible and scalable power solution for actuation and power conversion applications, including landing systems, de-icing systems, wheels and braking systems, high lift, and primary and secondary flight control actuation systems. Customization options are also available to ensure a flexible product offering for customers. The PCM developed in partnership with Airbus, for example, has been designed for harsh environments and has undergone a comprehensive application-specific qualification and reliability program.
”As an aircraft designer, Airbus is constantly concerned with improvements in safety and performance through the adoption of new technologies such as flight control surfaces with electric actuators, forward facing crew cockpits and control systems with side sticks,” said Alain Sagansan, Airbus research project leader. “Research studies on future architectures show the increased integration of standard modules with resulting logistical benefits. This paves the way for the adoption of new technologies as we move toward MEA solutions.”
The Airbus design by Microsemi accommodates a wide range of voltages, including the emerging 540 volt supply rail being introduced on the latest generation of commercial aircraft. The design process is structured on the DO-254 quality standard.
“The collaboration between Airbus and Microsemi aims to enhance the ever-important onboard electronic performance,” said Michel Todeschi, Airbus senior expert. “The Microsemi team’s technological mastery in semiconductors, power modules and control electronics enables us to propose these adapted and optimized solutions. The electric actuators with integrated PCMs provide solutions to increase equipment maturity and reliability while reducing the cost.”
Key features of Microsemi’s new aerospace PCM include:
Product Availability
Microsemi’s aerospace PCM with the embedded HPD is available for sampling. Evaluation kits will be available to order in December. For more information, including datasheets and application notes, visit https://www.microsemi.com/applications/commercial-aviation or contact sales.support@microsemi.com.
Microsemi’s Aviation Centre of Excellence
In February, Microsemi announced the opening of its Aviation Centre of Excellence in Ennis to support the design, development and manufacturing of its new product line of high reliability aviation IPS. The facility not only provides access to a portfolio of highly integrated, flexible and scalable solutions, but customers also have access to a full technical service provider as an extension of their design teams. The facility’s new research and development laboratory is fully resourced with modeling, simulation, analysis and algorithm development capabilities providing accelerated product innovation. The state-of-the-art measuring equipment enables extensive product testing while a dedicated reliability laboratory facilitates product qualification and long-term application specific life testing. The Aviation Centre of Excellence enables the company to offer a complete solution for high reliability aviation intelligent power solutions from design to manufacturing.
Microsemi Giving Wings to Innovation in Aerospace Electronics
Microsemi offers an industry-leading range of high reliability products and solutions for flight critical avionics and power conversion applications addressing the evolving needs of the aviation industry. Microsemi provides best-in-class FPGA and system-on-chip (SoC) technology for low power and SEU immunity, broadest range of transient voltage suppression (TVS) solutions for lightning protection, high performance power discrete technology such as IGBTs, silicon carbide (SiC) MOSFETs, diodes and their ruggedized power modules, a comprehensive analog and mixed-signal integrated circuit (IC) capability including high temperature SiC transistor drivers and sensor interface ICs, Ethernet and networking technologies, radio frequency (RF) diodes, power transistors, MMICs, modules and subsystems, and advanced packaging services including high temperature (HT) Polymer packaging technology. Microsemi continues to expand its leadership through product innovation and is building a solution capability by leveraging its broad portfolio of products to develop a new portfolio of intelligent power solutions in its Aviation Centre of Excellence, which serves as a full technical provider from design to manufacturing. For more information on Microsemi’s aviation products and technologies, visit https://www.microsemi.com/applications/commercial-aviation.
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