Categories: Components

IDT Expands Power Portfolio with New Dual-Phase High-Performance Digital Power Controller

Supporting Multiple Configurations, the ZSPM1363 PWM Controller Targets High-Power System Rails, Telecommunications, Server, Storage, FPGA and Infrastructure Applications

SAN JOSE, Calif., March 30, 2016— Integrated Device Technology, Inc.® (IDT®) (NASDAQ: IDTI) today strengthened its offerings of power management products with the introduction of a high-performance dual-phase digital power controller that can help customers optimize, monitor and control high-power supply systems. The second-generation ZSPM1363digital PWM (pulse-width modulation) controller delivers high performance and excellent transient response, making it ideal for addressing the growing demands in the telecommunications, server, storage, FPGA and infrastructure markets.

The chip’s extended one-time programmable (OTP) memory provides storage for multiple application configurations. The device’s flexibility and ease of reuse help reduce design time, and the highly integrated silicon requires few external components to help lower system cost.

“System designers are increasingly adopting digital technology to control their high-power supply systems,” said Ed Lam, senior director of IDT’s Power Business Unit. “The ZSPM1363 is a high-performance digital power controller that delivers design flexibility to reduce development cost and time to market. And because we developed it using automotive design methodology, the chip is rugged and highly reliable, with operating temperatures up to 125°C.”

The ZSPM1363 features simple resistor-based compensation adjustment after programming if load condition changes; there’s no need to reprogram the chip. And its multi-programmable compensation architecture achieves fast transient response while providing low ripple, steady state performance.

A related paper, titled, “Controller Scalability Methods for Digital Point Of Load Converters,” can be downloaded here.

Availability

The ZSPM1363 is available now in a compact 5×5 mm 32-QFN package.

Liat

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