Categories: Connectors & Cables

Molex Debuts Nano-Pitch I/O™ 80-Circuit Interconnect at DesignCon 2016 System offers highest port density and speed in the smallest available package

System offers highest port density and speed in the smallest available package

LISLE, IL – March 9, 2016 – At DesignCon 2016, Molex, LLC introduced the Nano-Pitch I/O™ 80-Circuit Interconnect System, which offers the highest port density (number of high-speed differential lanes) and speed (25 Gbps per lane) in the smallest package available. A multi-protocol pinout concept enables compatibility with all known SAS, SATA and PCIe protocols and provides enhanced signal integrity in an extremely compact form factor. The connector is ideal for SAS and PCI Express applications, including storage-to-controller, server-to-server, server-to-switch, switch-to-switch, and mobile/enterprise.

“With an industry-leading port density, multi-protocol application support, and enhanced signal integrity, the Nano-Pitch I/O 80-Circuit Interconnect System is redefining PCIe and SAS solutions within the storage industry,” said Joe Dambach, product manager, Molex.

The system’s flexible pinout concept (continuous Ground-Signal-Signal-Ground) optimizes it for high-speed applications and maximizes the number of high-speed lanes within the lengths provided. Eight lanes (80 circuit) are available, per industry standard.

The system’s small form factor (5mm × 23mm × 9mm) and a 12mm mated connector-to-cable assembly height for right angle cable exit) allow it to service mobile devices through enterprise applications. Staggered, reliable and constant dual-row contact configuration delivers hot pluggability (the ability to add components without shutting down the system). Also, the connector provides optimal routing for high-speed trace connections while reducing the need for PCB real estate.

Storage systems applications for the Nano-Pitch I/O 80-Circuit Interconnect System include data center and enterprise storage systems, storage racks, JBODs, storage controllers, HBA servers, and RAIDS. Telecommunications/networking applications for the connector include hubs, servers, switches, and routers.

For more information about the Nano-Pitch I/O™ Interconnect System from Molex, please visitwww.molex.com/link/nanopitchio.html.

com.

Liat

Recent Posts

QuamCore Emerges from Stealth with $9 Million in Seed Funding to Build World’s First Scalable 1 million Qubit Quantum Computer

Breakthrough in superconducting digital logic removes quantum scaling barriers, paving the way for large-scale quantum…

1 day ago

Qualcomm to Bolster AI and IoT Capabilities with Edge Impulse Acquisition

Highlights:  Acquisition complements strategic approach to IoT transformation, enhances developer enablement and expands leadership in…

4 days ago

Tower Semiconductor and Innolight Expand their Collaboration and Ramp Volume of Next-Generation SiPho Solutions for AI and Data Centers

New Technology Halves Laser Requirements for Streamlined, High-Volume Optical Module Production to Meet Growing AI…

4 days ago

Lenovo Just Launched the World’s First Laptop with an Under-Display Camera: Here’s How They Did It

Lenovo has redefined laptop innovation with the introduction of the Yoga Slim 9i, the world’s…

1 week ago

Power Supplies 10 to 50W industrial power supply series expanded with new mounting and protection options for increased system flexibility

TDK Corporation (TSE 6762) announces the introduction of multiple option configurations for the TDK-Lambda brand…

1 week ago

Nordic Semiconductor collaborates with Deutsche Telekom to make everything cellular connected

Introducing MECC: A seamless, scalable solution to unlock global IoT connectivity using nRF9151 module Nordic…

1 week ago