Cadence Announces the HiFi Integrator Studio

Highlights:

• Innovative new technology provides audio framework for HiFi DSP processors
• Leverages over 175 existing optimized application software packages
• First integration of hardware with the Android Studio development platform

Cadence Design Systems, Inc. (NASDAQ: CDNS), today announced the Cadence® HiFi Integrator Studio, an audio software framework that provides OEMs and application developers faster time to market when integrating Tensilica® HiFi DSP-based systems on chip (SoCs) into their products. This announcement also includes the availability of the first hardware integration into the Android Studio development platform. Cadence is scheduled to demonstrate the “OK Google” voice trigger and audio playback integration with Android Studio and the Realtek ALC5677 at the Mobile World Congress in Barcelona, February 22 to 25, at Fira Gran Via, Hall 6, Stand 6L36.

The HiFi Integrator Studio provides a standard operating-system (OS)-agnostic software framework to interface audio, voice and sensor functions running on the HiFi DSP to higher level applications such as media players or recorders. It enables high-level application programmers using Java/C++ to leverage the power-savings and acceleration benefits of the HiFi DSP without having to understand the low-level programming details of a real-time DSP.

The HiFi Integrator Studio currently supports two main use cases, with additional ones in development. The first use case is targeted at SoCs where the HiFi DSP is the main processor, such as in a Bluetooth headset. The second use case is targeted at systems where a host application processor (AP) offloads audio and/or voice tasks to the HiFi DSP processor. Examples include using the HiFi DSP as part of the AP SoC and/or in codec chips for ultra-low-power, glitch-free audio playback, and noise suppression and echo cancellation for superior voice experience.

The Android OS version demonstrates a complete end-to-end application from Java applications at the top, to Android Marshmallow-based middleware, to offloaded code running on the HiFi DSP—all in the Android Studio development environment. The integration with Android leverages the previously announced Cadence Tensilica HiFi Audio Tunneling for Android, which can reduce audio processing power by up to 14X and double smartphone playback time. By integrating the HiFi DSP in hardware together with Google’s Android Studio emulator running on a PC, system developers can separate audio integration from Android bring-up, allowing earlier development of audio system software and enabling the developers to take advantage of the rich debugging environments available on PCs. Releases for Linux and other popular OSs will follow.

The Tensilica HiFi DSP is production proven for ultra-low power audio and voice functions in mobile devices. It has a well-supported ecosystem with over 175 proven audio/voice software packages and over 80 partners. All of the existing 175+ available applications utilize the common HiFi applications programming interface (API) and are fully plug-and-play ready for integration using HiFi Integrator Studio. For more information on the Tensilica HiFi DSP family, visit www.cadence.com/news/HiFiDSP/IntegratorStudio.

“We created the HiFi Integrator Studio to provide an environment for designers to easily integrate HiFi DSP-based SoCs into the most widely used OSs,” said Larry Przywara, group director of audio/voice DSP marketing at Cadence. “This framework speeds first-time integration of the HiFi-based SoCs and provides a clean separation of host OS and application software. In addition, the audio framework has been architected to support easy and fast maintenance and upgrades of HiFi-based platforms with the latest host AP OS releases.”

About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of today’s integrated circuits and electronics. Customers use Cadence software, hardware, IP and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers and research facilities around the world to serve the global electronics industry. More information about the company, its products and its services is available at www.cadence.com.

This press release contains certain forward-looking statements that are based on our current expectations and involve numerous risks and uncertainties that may cause these forward-looking statements to be inaccurate. Risks that may cause these forward-looking statements to be inaccurate include, among others: our product development plans may change, and the other risks detailed from time-to-time in our U.S. Securities and Exchange Commission filings and reports, including, but not limited to, our most recent quarterly report on Form 10-Q and our annual report on Form 10-K. We do not intend to update the information contained in this press release.