Categories: NEW PRODUCTS

Xilinx Announces Publicly Available Tools and Documentation for 16nm UltraScale+ Devices

Enabling mainstream market adoption and validation of 2-5X greater system level performance/watt over 28nm devices

AN JOSE, Calif., Dec. 8, 2015 /PRNewswire/ — Xilinx, Inc. (NASDAQ:XLNX) today announced public access support for 16nm UltraScale+™ families, including the Vivado® Design Suite HLx Editions, embedded software development tools, Xilinx Power Estimator, and technical documentation for Zynq® UltraScale+ MPSoC and Kintex® UltraScale+ devices. Designers can now validate the UltraScale+ portfolio’s 2-5X performance/watt improvement over 28nm offerings for their specific designs. This announcement marks the industry’s first publicly available tools for 16nm devices, enabling broad market adoption. The Vivado Design Suite has been co-optimized to fully exploit the UltraScale+ portfolio’s performance/watt advantages and the complete catalog of SmartCORE™ and LogiCORE™ IP. This announcement follows previous UltraScale+ portfolio milestones, including first tape out and early access tools in July 2015, and first customer shipment in September 2015.

“As the industry’s only supplier of public tools and documentation for 16nm programmable devices, we are accelerating mainstream adoption of the most advanced SoCs and FPGAs available today,” said Kirk Saban, senior director of FPGA and SoC product management and marketing. “All customers can now validate the superior performance/watt advantages of the UltraScale+ portfolio for their next generation applications.”

Availability

Zynq UltraScale+ and Kintex UltraScale+ devices are supported in the Vivado Design Suite 2015.4, HLx Editions. Also available for download are the Xilinx Software Design Kit, Xilinx Power Estimator, and technical documentation for Zynq UltraScale+ and Kintex UltraScale+ families. To learn more about Xilinx development environments visit the Xilinx Hardware Developer Zone and Xilinx Software Developer Zone.

Liat

Recent Posts

Infineon receives approval for funding under the EU Chips Act – IPCEI funding drives innovation projects in Europe forward

The European Commission today approved funding under the European Chips Act for the Infineon Technologies…

2 days ago

OpenAI set to finalize first custom chip design this year

OpenAI Moves Forward with Custom AI Chip Development OpenAI is making strides to reduce its…

5 days ago

Siemens and Compute Maritime collaborate to transform ship design using generative AI

Brings together bleeding-edge AI maritime design technology with industry-leading simulation capability to create innovative and…

5 days ago

New Bluetooth module from Panasonic Industry offers great performance while minimizing current consumption

PAN B511-1C is the perfect solution for Matter applications The newly launched small and cost-effective…

5 days ago

Industry-standard switching & simulation systems from Pickering Interfaces on show at Space-Comm Expo

Pickering Interfaces will showcase its range of industry-standard modular signal switching and simulation products for…

5 days ago

NXP Agrees to Acquire Edge AI Pioneer Kinara to Redefine the Intelligent Edge

Eindhoven, the Netherlands, February 10, 2025 – NXP Semiconductors N.V. (NASDAQ: NXPI) today announced it…

5 days ago