New family meets stringent EMI/EMC specifications and maximizes design flexibility for rugged industrial applications
Texas Instruments (TI) (NASDAQ: TXN) today introduced the industry’s lowest latency and highest electrostatic discharge (ESD) industrial Gigabit Ethernet physical layers (PHYs). The new family of six devices enables engineers to bring real-time industrial Internet of Things (IIoT) capabilities to rugged factory automation systems, motor drives, and test and measurement equipment. The new DP83867 family meets stringent electromagnetic interference (EMI) and electromagnetic compatibility (EMC) standards, reduces power consumption, and offers designers flexibility with multiple temperature, media access control (MAC) interface and packaging options. For more information, visit https://www.ti.com/dp83867-pr-
See the DP83867 in action in an Ethernet PHY demo in TI’s booth (No. 6-441) at the SPS IPC Drives conference, Nov. 24-26, in Nuremberg, Germany.
Key features and benefits of the DP83867 industrial Gigabit Ethernet PHYs
Tools and support to speed design
Evaluation modules (EVMs) available today from the TI store and authorized distributors enable designers to quickly and easily evaluate the new devices. The DP83867IRPAP-EVM supports the gigabit media independent interface (GMII) and reduced GMII (RGMII) and is priced at US$199, and the DP83867ERGZ-R-EVM supports RGMII and is priced at $199. Designers can download IBIS models and the JTAG BSDL model to further speed evaluation.
Designers can jumpstart their design with the EMI/EMC-compliant industrial-temperature-grade Gigabit Ethernet reference design, which includes the Sitara™ AM335x processor with integrated Ethernet MAC and switch.
Engineers can search for solutions, get help, share knowledge, and solve problems with fellow engineers and TI experts in the TI E2E™ Community Ethernet forum.
Package, availability and pricing
The DP83867 industrial Gigabit Ethernet PHY family is available today with prices starting at US$4.40 in 1,000-unit quantities. Designers can select from two package options: a 48-pin quad-flat no-lead (QFN) package for space-constrained applications, and a 64-pin quad flat package (QFP) optimized for ease of use.
In addition to temperature grade options, several pin-to-pin compatible MAC interface options give designers flexibility to interface with various processors or field programmable gate arrays (FPGAs). These temperature and MAC interface options also help designers of non-industrial connected applications such as Internet Protocol (IP)-based network cameras, set-top boxes and computing applications meet the growing need for more rugged connectivity in their products.
Learn more about TI’s Ethernet portfolio
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