congatec’s new COM Express modules deliver server-class embedded performance
Deggendorf, Germany, 29 October 2015 * * * congatec AG, a leading technology company for embedded computer modules, single board computers (SBCs) and embedded design and manufacturing (EDM) services, has expanded its COM Express Basic portfolio with new server-class embedded modules. The new Server-on-Modules are equipped with 6th generation Intel® Xeon® and Intel® Core™ i3 / i5 / i7 processors (codenamed Skylake). The DDR4 memory of the conga-TS170 modules provides up to twice as much system memory performance for data-intensive applications while consuming 20 percent less energy and requiring only half the footprint of DDR3 RAM that is expected to become legacy in future applications. In addition, the modules offer faster processor speeds, a 60 percent accelerated system bus and an enlarged Intel® Smart Cache (up to 8 MB) as well as the PCIe Gen 3.0 support for all PCIe Lanes and the new Intel® HD Graphics P530. Overall, users can expect to benefit from enhanced system performance and packing density with lower space and energy requirements.
The new conga-TS170 modules are equipped with the latest 6th generation 14nm Xeon® v5 and Intel® Core™ processors. They feature a TDP of 25-45W, up to 8MB smart cache and super-fast 2133 DDR4 memory up to 32 GB, implemented as ECC memory for safety-critical applications in the Intel® Xeon variants. For energy-efficient 24/7 operation, the new modules support disconnected standby in place of the legacy S3 mode. With disconnected standby, switching from energy-saving sleep mode to full performance takes less than half a second; as a result, systems can go into sleep mode more frequently without affecting usability and responsiveness.
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